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Recent advances on kinetic analysis of solder joint reactions in 3D IC packaging technology
Publication date: April 2019Source: Materials Science and Engineering: R: Reports, Volume 136Author(s): K.N. Tu, Yingxia LiuAbstractWe review five solder joint reactions in 3D IC packaging technology which are of wide interest: (1) Scallop-type growth of Cu6Sn5 in solid-liquid interdiffusion reaction, (2) Whisker-type growth of Sn crystals at room temperature, (3) Layer-type intermetallic compound (IMC) growth in solid state aging, (4) Porous-type growth of Cu3Sn in μ-bumps, and (5) Pillar-type growth of Cu/Sn IMC down to 1 μm in diameter. The first two have been well covered in books and reviews on solder joint techno...
Source: Materials Science and Engineering: R: Reports - October 4, 2018 Category: Materials Science Source Type: research

A comprehensive review of lithium salts and beyond for rechargeable batteries: Progress and perspectives
Publication date: December 2018Source: Materials Science and Engineering: R: Reports, Volume 134Author(s): A. Mauger, C.M. Julien, A. Paolella, M. Armand, K. ZaghibAbstractThe increasing need for energy storage has been the motivation for intensive research in batteries with different chemistries in the recent past. Among the elements of the batteries, the salts and their solvent play an important role. In particular, the cathodic stability at low potential depends importantly on the choice of the cation, while the stability at high potentials is mainly due to oxidation of anions and the ion mobility and dissociation depen...
Source: Materials Science and Engineering: R: Reports - August 29, 2018 Category: Materials Science Source Type: research

Structural evolutions of metallic materials processed by severe plastic deformation
Publication date: November 2018Source: Materials Science and Engineering: R: Reports, Volume 133Author(s): Yang Cao, Song Ni, Xiaozhou Liao, Min Song, Yuntian ZhuAbstractBulk nanostructured (ns)/ultrafine-grained (UFG) metallic materials possess very high strength, making them attractive for high strength, lightweight and energy efficient applications. The most effective approach to produce bulk ns/UFG metallic materials is severe plastic deformation (SPD). In the last 30 years, significant research efforts have been made to explore SPD processing of materials, SPD-induced microstructural evolutions, and the resulting mech...
Source: Materials Science and Engineering: R: Reports - August 25, 2018 Category: Materials Science Source Type: research

Editorial Board
Publication date: September 2018Source: Materials Science and Engineering: R: Reports, Volume 131Author(s): (Source: Materials Science and Engineering: R: Reports)
Source: Materials Science and Engineering: R: Reports - July 29, 2018 Category: Materials Science Source Type: research

High-entropy alloys and metallic nanocomposites: Processing challenges, microstructure development and property enhancement
Publication date: September 2018Source: Materials Science and Engineering: R: Reports, Volume 131Author(s): Amit S. Sharma, Surekha Yadav, Krishanu Biswas, Bikramjit BasuAbstractTwo classes of new materials, i.e. high entropy alloys (HEAs) and metallic nanocomposites offer processing related challenges, while showing significant promise for an array of technological applications requiring wear and irradiation resistance. This review addresses those challenges together with microstructure-property correlations. In particular, the main focus of this review is to demonstrate the efficacy of the superfast densification route, ...
Source: Materials Science and Engineering: R: Reports - July 10, 2018 Category: Materials Science Source Type: research

Thermal conductivity of polymers and polymer nanocomposites
Publication date: October 2018Source: Materials Science and Engineering: R: Reports, Volume 132Author(s): Congliang Huang, Xin Qian, Ronggui YangAbstractPolymers are widely used in industry and in our daily life because of their diverse functionality, light weight, low cost and excellent chemical stability. However, on some applications such as heat exchangers and electronic packaging, the low thermal conductivity of polymers is one of the major technological barriers. Enhancing the thermal conductivity of polymers is important for these applications and has become a very active research topic over the past two decades. In...
Source: Materials Science and Engineering: R: Reports - July 10, 2018 Category: Materials Science Source Type: research

Editorial Board
Publication date: August 2018Source: Materials Science and Engineering: R: Reports, Volume 130Author(s): (Source: Materials Science and Engineering: R: Reports)
Source: Materials Science and Engineering: R: Reports - July 5, 2018 Category: Materials Science Source Type: research

Recent progress in ultrathin two-dimensional semiconductors for photocatalysis
Publication date: August 2018Source: Materials Science and Engineering: R: Reports, Volume 130Author(s): Hui Wang, Xiaodong Zhang, Yi XieAbstractBenefiting from the unique electronic structures and high specific surface areas, two-dimensional (2D) semiconductors present significant advantages in photocatalytic researches for realizing efficient solar energy utilization. As compared with the bulk counterparts, 2D semiconductors tend to possess distinct photoexcitation processes and thus diverse photocatalytic behaviors, owing to the abundant surface structural factors and strong quantum confinement effects. Accordingly, eno...
Source: Materials Science and Engineering: R: Reports - July 5, 2018 Category: Materials Science Source Type: research

High-entropy alloys and metallic nanocomposites: Processing challenges, microstructure development and property enhancement
Publication date: September 2018Source: Materials Science and Engineering: R: Reports, Volume 131Author(s): Amit S. Sharma, Surekha Yadav, Krishanu Biswas, Bikramjit BasuAbstractTwo classes of new materials, i.e. high entropy alloys (HEAs) and metallic nanocomposites offer processing related challenges, while showing significant promise for an array of technological applications requiring wear and irradiation resistance. This review addresses those challenges together with microstructure-property correlations. In particular, the main focus of this review is to demonstrate the efficacy of the superfast densification route, ...
Source: Materials Science and Engineering: R: Reports - July 5, 2018 Category: Materials Science Source Type: research

High-entropy alloys and metallic nanocomposites: Processing challenges, microstructure development and property enhancement
Publication date: September 2018 Source:Materials Science and Engineering: R: Reports, Volume 131 Author(s): Amit S. Sharma, Surekha Yadav, Krishanu Biswas, Bikramjit Basu Two classes of new materials, i.e. high entropy alloys (HEAs) and metallic nanocomposites offer processing related challenges, while showing significant promise for an array of technological applications requiring wear and irradiation resistance. This review addresses those challenges together with microstructure-property correlations. In particular, the main focus of this review is to demonstrate the efficacy of the superfast densification route, ...
Source: Materials Science and Engineering: R: Reports - June 20, 2018 Category: Materials Science Source Type: research

Electrically conducting fibres for e-textiles: An open playground for conjugated polymers and carbon nanomaterials
Publication date: April 2018 Source:Materials Science and Engineering: R: Reports, Volume 126 Author(s): Anja Lund, Natascha M. van der Velden, Nils-Krister Persson, Mahiar M. Hamedi, Christian Müller Conducting fibres and yarns promise to become an essential part of the next generation of wearable electronics that seamlessly integrate electronic function into one of the most versatile and most widely used form of materials: textiles. This review explores the many types of conducting fibres and yarns that can be realised with conjugated polymers and carbon materials, including carbon black, carbon nanotubes and gra...
Source: Materials Science and Engineering: R: Reports - May 7, 2018 Category: Materials Science Source Type: research

Recent progress in ultrathin two-dimensional semiconductors for photocatalysis
Publication date: August 2018 Source:Materials Science and Engineering: R: Reports, Volume 130 Author(s): Hui Wang, Xiaodong Zhang, Yi Xie Benefiting from the unique electronic structures and high specific surface areas, two-dimensional (2D) semiconductors present significant advantages in photocatalytic researches for realizing efficient solar energy utilization. As compared with the bulk counterparts, 2D semiconductors tend to possess distinct photoexcitation processes and thus diverse photocatalytic behaviors, owing to the abundant surface structural factors and strong quantum confinement effects. Accordingly, enor...
Source: Materials Science and Engineering: R: Reports - April 25, 2018 Category: Materials Science Source Type: research

Additive manufacturing of multi-material structures
Publication date: July 2018 Source:Materials Science and Engineering: R: Reports, Volume 129 Author(s): Amit Bandyopadhyay, Bryan Heer Additive manufacturing (AM) or 3D printing has revolutionized the manufacturing world through its rapid and geometrically-intricate capabilities as well as economic benefits. Countless businesses in automotive, aerospace, medical, and even food industries have adopted this approach over the past decade. Though this revolution has sparked widespread innovation with single material usage, the manufacturing world is constantly evolving. 3D printers now have the capability to create multi-m...
Source: Materials Science and Engineering: R: Reports - April 15, 2018 Category: Materials Science Source Type: research

Solution-processable organic and hybrid gate dielectrics for printed electronics
Publication date: May 2018 Source:Materials Science and Engineering: R: Reports, Volume 127 Author(s): Jinhua Li, Wei Tang, Qiang Wang, Wenjian Sun, Qing Zhang, Xiaojun Guo, Xianbao Wang, Feng Yan Over the few past decades, printed electronics as an emerging technology have achieved tremendous progress in material design and device fabrication. OTFTs are the key building blocks of many electronic devices. Printable OTFTs have promising applications in flexible circuits, sensors and backplanes for active-matrix displays. Gate dielectrics play key roles in OTFTs to afford electrical insulating properties and interf...
Source: Materials Science and Engineering: R: Reports - March 14, 2018 Category: Materials Science Source Type: research