Effective acquisition of elastoplastic and creep parameters of lead-free solder alloy from high-temperature micro-indentation eliminating the size effect

Publication date: Available online 10 July 2021Source: Mechanics of MaterialsAuthor(s): Gesheng Xiao, Yuhong Ma, Xinkuo Ji, Tiejun Wang, Xuefeng Shu, Erqiang Liu
Source: Mechanics of Materials - Category: Materials Science Source Type: research