Rational design of Ag nanoparticle/polymer brush and its application in electroless deposition to fabricate adhesion-enhanced copper pattern for functional flexible electronics

Publication date: Available online 8 July 2021Source: Journal of the Taiwan Institute of Chemical EngineersAuthor(s): Ruxia Zhang, Chengmei Gui, Junjun Huang, Guisheng Yang
Source: Journal of the Taiwan Institute of Chemical Engineers - Category: Chemistry Source Type: research