Investigation on the sawing temperature in ultrasonic vibration assisted diamond wire sawing monocrystalline silicon

Publication date: 15 November 2021Source: Materials Science in Semiconductor Processing, Volume 135Author(s): Yan Wang, Li-Xing Song, Jian-Guo Liu, Rui Wang, Bo-Cheng Zhao

Source: Materials Science in Semiconductor Processing - July 7, 2021 Category: Materials Science Source Type: research