Copper Nanoparticles Interlocked Phase-Change Microcapsules for Thermal Buffering in Packaging Application

Publication date: Available online 2 July 2021Source: Journal of Industrial and Engineering ChemistryAuthor(s): Sumit Parvate, Jitendra Singh, Jagadeeswara Reddy Vennapusa, Prakhar Dixit, Sujay Chattopadhyay

Source: Journal of Industrial and Engineering Chemistry - July 3, 2021 Category: Chemistry Source Type: research