Mechanical behaviors of lotus-type porous Cu/Cu joint soldered by Sn-3.0Ag-0.5Cu alloy

Publication date: Available online 28 June 2021Source: Materials Science and Engineering: AAuthor(s): Sang-Wook Kim, Kwang-Tae Son, Soong-Keun Hyun
Source: Materials Science and Engineering: A - Category: Materials Science Source Type: research