Highly Conductive Thermal Interface Materials with Vertically Aligned Graphite-Nanoplatelet Filler Towards: High Power Density Electronic Device Cooling

Publication date: Available online 16 June 2021Source: CarbonAuthor(s): Xulei Wu, Huatao Wang, Ziao Wang, Jinglong Xu, Yajin Wu, Rui Xue, Hongxin Cui, Cong Tian, Yu Wang, Xiaoxiao Huang, Bo Zhong
Source: Carbon - Category: Materials Science Source Type: research