Enhanced strength, ductility and electrical conductivity of Cu–Te alloys via dynamic recrystallization and precipitation

Publication date: 13 July 2021Source: Materials Science and Engineering: A, Volume 820Author(s): Zhe Shen, Zhongze Lin, Peijian Shi, Ganpei Tang, Tianxiang Zheng, Chunmei Liu, Yifeng Guo, Yunbo Zhong
Source: Materials Science and Engineering: A - Category: Materials Science Source Type: research