Flexible and adhesive sintered Cu nanomaterials on polyimide substrates prepared by combining Cu nanoparticles and nanowires with polyvinylpyrrolidone

Publication date: 20 September 2021Source: Colloids and Surfaces A: Physicochemical and Engineering Aspects, Volume 625Author(s): Shun Yokoyama, Junpei Nozaki, Yuta Umemoto, Kenichi Motomiya, Takashi Itoh, Hideyuki Takahashi
Source: Colloids and Surfaces A: Physicochemical and Engineering Aspects - Category: Chemistry Source Type: research