Polymer-based Cu/Ag composite as seed layer on insulating substrate for copper addition of multi-dimensional conductive patterns

Publication date: Available online 3 June 2021Source: Journal of the Taiwan Institute of Chemical EngineersAuthor(s): Jiujuan Li, Yan Hong, Guoyun Zhou, Huaiwu Zhang, Wei He, Shouxu Wang, Yuanming Chen, Chong Wang, Xinhong Su, Yukai Sun, Martin Andersson
Source: Journal of the Taiwan Institute of Chemical Engineers - Category: Chemistry Source Type: research