Influence of silicon anisotropy on surface shape deviation of wafer by diamond wire saw

Publication date: October 2021Source: Materials Science in Semiconductor Processing, Volume 133Author(s): Zongqiang Li, Peiqi Ge, Wenbo Bi, Chengyun Li, Chao Wang, Jianfeng Meng
Source: Materials Science in Semiconductor Processing - Category: Materials Science Source Type: research