Enhanced tensile ductility of tungsten microwires via high-density dislocations and reduced grain boundaries

Publication date: Available online 1 June 2021Source: Journal of Materials Science & TechnologyAuthor(s): Chaoqun Dang, Weitong Lin, Fanling Meng, Hongti Zhang, Sufeng Fan, Xiaocui Li, Ke Cao, Haokun Yang, Wenzhao Zhou, Zhengjie Fan, Ji-jung Kai, Yang Lu
Source: Journal of Materials Science and Technology - Category: Materials Science Source Type: research