In-situ deposition of diamond on functionally graded copper scaffold for improved thermal conductivity and mechanical properties

Publication date: 15 September 2021Source: Materials Letters, Volume 299Author(s): Kaka Cheng, Wei Xiong, Yan Li, Danna Tang, Haoze Geng, Mingxi Sun, Liang Hao, Hua Sheng Wang, Han Zhang
Source: Materials Letters - Category: Materials Science Source Type: research