Die attachment, wire bonding, and encapsulation process in LED packaging: A review

Publication date: Available online 7 May 2021Source: Sensors and Actuators A: PhysicalAuthor(s): Md. Abdul Alim, M.Z. Abdullah, M.S. Abdul Aziz, R. Kamarudin

Source: Sensors and Actuators A: Physical - May 9, 2021 Category: Physics Source Type: research