Cracking mechanism of CdZnTe polycrystalline film deposited on TFT circuit board at high temperature by close-spaced sublimation method

Publication date: 15 August 2021Source: Materials Science in Semiconductor Processing, Volume 131Author(s): Yiwei Li, Wenyu Zhang, Kun Cao, Yang Li, Gangqiang Zha, Tingting Tan
Source: Materials Science in Semiconductor Processing - Category: Materials Science Source Type: research