High temperature aging of epoxy-based molding compound and its effect on mechanical behavior of molded electronic package

Publication date: Available online 6 April 2021Source: Polymer Degradation and StabilityAuthor(s): Adwait Inamdar, Yu-Hsiang Yang, Alexandru Prisacaru, Przemyslaw Gromala, Bongtae Han

Source: Polymer Degradation and Stability - April 6, 2021 Category: Chemistry Source Type: research