Accelerated Reliability Testing of Cu-Al Bimetallic Contact by a Micropattern Corrosion Testing Platform for Wire Bond Device Application

Publication date: Available online 26 March 2021Source: MethodsXAuthor(s): Goutham Issac Ashok Kumar, John Alptekin, Joshua Caperton, Ashish Salunke, Oliver Chyan

Source: MethodsX - March 27, 2021 Category: Science Source Type: research