Novel micro-nano epoxy composites for electronic packaging application: balance of thermal conductivity and processability

Publication date: Available online 26 March 2021Source: Composites Science and TechnologyAuthor(s): Yang Hu, Chao Chen, Yingfeng Wen, Zhigang Xue, Xingping Zhou, Dean Shi, Guohua Hu, Xiaolin Xie

Source: Composites Science and Technology - March 27, 2021 Category: Science Source Type: research