The effect of interface stress on the grain boundary grooving in nanomaterials: Application to the thermal degradation of Cu/W nano-multilayers

Publication date: 1 July 2021Source: Scripta Materialia, Volume 199Author(s): A.V. Druzhinin, C. Cancellieri, L.P.H. Jeurgens, B.B. Straumal
Source: Scripta Materialia - Category: Materials Science Source Type: research