Improvement in chemical mechanical polishing of 4H-SiC wafer by activating persulfate through the synergistic effect of UV and TiO2

Publication date: Available online 24 March 2021Source: Journal of Materials Processing TechnologyAuthor(s): Wantang Wang, Baoguo Zhang, Yunhui Shi, Tengda Ma, Jiakai Zhou, Ru Wang, Hanxiao Wang, Nengyuan Zeng
Source: Journal of Materials Processing Technology - Category: Materials Science Source Type: research