Electrospun antimicrobial materials: Advanced packaging materials for food applications

Publication date: May 2021Source: Trends in Food Science & Technology, Volume 111Author(s): Fatemeh Hemmati, Akbar Bahrami, Afshin Faridi Esfanjani, Hedayat Hosseini, David Julian McClements, Leonard Williams

Source: Trends in Food Science and Technology - March 23, 2021 Category: Food Science Source Type: research