Inhibiting the detrimental Cu protrusion in Cu through-silicon-via by highly (111)-oriented nanotwinned Cu

Publication date: May 2021Source: Scripta Materialia, Volume 197Author(s): Ting-Chun Lin, Chien-Lung Liang, Shan-Bo Wang, Yung-Sheng Lin, Chin-Li Kao, David Tarng, Kwang-Lung Lin
Source: Scripta Materialia - Category: Materials Science Source Type: research