Fabrication and Characteristics of Cu@Ag Composite Solder Preform by Electromagnetic Compaction for Power Electronics

Publication date: Available online 19 January 2021Source: Journal of Materials Processing TechnologyAuthor(s): Chengjiong Tuo, Zhenhua Yao, Wei Liu, Shengfa Liu, Li Liu, Zhiwen Chen, Shangyu Huang, Changqing Liu, Xueqiang Cao
Source: Journal of Materials Processing Technology - Category: Materials Science Source Type: research