Effect of EDTA-based alkaline cleaning solution on TAZ removal in post CMP cleaning of copper interconnection

Publication date: Available online 4 January 2021Source: Materials Research BulletinAuthor(s): Da Yin, Qi Wang, Shihao Zhang, Baimei Tan, Fan Yang, Ru Wang, Xiaoqin Sun, Mengrui Liu

Source: Materials Research Bulletin - January 5, 2021 Category: Materials Science Source Type: research