Thermally stable, low resistance Mg2Si0.4Sn0.6/Cu thermoelectric contacts using SS 304 interlayer by one step sintering

Publication date: Available online 30 November 2020Source: Materials Research BulletinAuthor(s): B. Jayachandran, B. Prasanth, R. Gopalan, T. Dasgupta, Sivaprahasam D.

Source: Materials Research Bulletin - November 30, 2020 Category: Materials Science Source Type: research