Characterization and application of Cu based superhydrophobic catalyst

Publication date: Available online 10 September 2019Source: Progress in Natural Science: Materials InternationalAuthor(s): Ramasamy Anbarasan, Shanmugam Palanikumar, Ayyadurai Anitha Devi, Ping-Hei Chen, Kuo Lun TungAbstractSuperhydrophobic (SH) Copper salt was prepared with the help of three different chemical etching agents and characterized by various analytical techniques like Fourier transform infrared (FTIR) spectroscopy, UV–visible spectroscopy, X-ray diffractogram (XRD), X-ray photoelectron spectroscopy (XPS), high resolution transmission electron microscopy (HRTEM) and scanning electron microscopy (SEM). The SH nature of the material was confirmed by water contact angle (WCA) measurement. Cu surface with the etching agent was made to produce SH Cu surface. Among the chemical etching agents the system with Cl, F and Si exhibited the SH character. The SH hierarchically structured heterogeneous materials produced were used as a catalyst for the reduction of Cr(VI) and 4-nitrophenol (NiP). The catalytic activities of the materials were compared on the apparent rate constant (kapp) and induction time (Ti). Among the catalyst systems used, the Cu-Trichoropentaflourooctylsilane (TCPFOSi) system exhibited the highest kapp and Ti values.Graphical abstract
Source: Progress in Natural Science: Materials International - Category: Materials Science Source Type: research