Improvisation of Interfacial Bond Strength in Shape Memory Alloy Hybrid Polymer Matrix Composites

Publication date: 2014 Source:Procedia Materials Science, Volume 6 Author(s): Vinod Murkute , Amit Gupta , D.G. Thakur , Rahul Harshe , Makarand Joshi In the present study, we report on a novel approach adopted for the improvisation of interfacial bond strength between shape memory alloy (SMA) and epoxy matrix in SMA hybrid composites. Methodologies such as surface roughening and chemical etching of SMA wires were performed before embedding them in epoxy matrix. A pull-out test has been performed to find out the improvement in load transfer between SMA and host matrix. Surface morphology of SMA wires after various surface treatments was observed under scanning electron microscope (SEM). Significant improvement, nearly 260%, in interfacial shear strength between SMA-Epoxy interfaces has been observed in case of specimens embedded with chemically etched SMA wire in comparison to the specimens with untreated SMA wire.
Source: Procedia Materials Science - Category: Materials Science Source Type: research