Development of plasma assisted thermal vapor deposition technique for high-quality thin film

The novel technique of Plasma-Assisted VaporDeposition (PAVD) is developed as a newdeposition method for thinmetalfilms. The PAVD technique yields a high-qualitythin film without any heating of the substrate because evaporated particles acquire energy fromplasma that is confined to the inside of theevaporationsource. Experiments ofsilverthin film deposition have been carried out in conditions ofpressure lower than 10−3 Pa. Puresilverplasma generation is verified by the measurement of the Ag-I peak using optical emission spectroscopy. A four point probe and a UV-VIS spectrophotometer are used to measure the electrical and optical properties of thesilverfilm that isdeposited by PAVD. For an ultra-thinsilverfilm with a thickness of 6.5 nm, we obtain the result of high-performancesilverfilm properties, including a sheet resistance75%. The PAVD-film properties show a low sheet resistance of 30% and the same transmittance with conventional thermalevaporationfilm. In the PAVDsource, highly energetic particles and UV fromplasma do not reach the substrate because theplasma is completely shielded by the optimized nozzle of the crucible. This new PAVD technique could be a realistic solution to improve the qualities of transparentelectrodes for organic light emission device fabrication without causing damage to the organic layers.

Source: Review of Scientific Instruments - December 6, 2016 Category: Physics Authors: Kang-Il Lee, Yong Sup Choi and Hyun Jae Park Source Type: research